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| M27W016 16 Mbit (1Mb x16) 3V Supply FlexibleROMTM Memory FEATURES SUMMARY s ONE TIME PROGRAMMABLE s Figure 1. Packages SUPPLY VOLTAGE - VCC = 2.7 to 3.6V for Read - VPP = 11.4 to 12.6V for Program s ACCESS TIME - 80ns at VCC = 3.0 to 3.6V - 100, 110ns at VCC = 2.7 to 3.6V PROGRAMMING TIME - 9s per Word typical - Multiple Word Programming Option (2s typical Chip Program) SO44 (M) TSOP48 (N) 12 x 20mm s s s SUITABLE FOR ON-BOARD PROGRAMMING PROGRAM CONTROLLER - Embedded Word Program algorithms 42 s ELECTRONIC SIGNATURE - Manufacturer Code: 0020h - Device Code : 888Dh 1 PDIP42 (B) 42 1 SDIP42 (S) November 2003 1/26 M27W016 TABLE OF CONTENTS FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Figure 1. Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Figure 2. Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Table 1. Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Figure 3. PDIP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 4. SDIP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 5. SO Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 6. TSOP Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 SIGNAL DESCRIPTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Address Inputs (A0-A19). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Data Inputs/Outputs (DQ0-DQ7). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Data Inputs/Outputs (DQ8-DQ15). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Chip Enable (E). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Output Enable (G). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 VCC Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 VPP Program Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Vss Ground.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 BUS OPERATIONS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Bus Read. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bus Write. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Output Disable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Standby. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Automatic Standby. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Electronic Signature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 2. Bus Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .....8 .....8 .....8 .....8 .....8 .....8 .....8 COMMAND INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Read/Reset Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Auto Select Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Word Program Command.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Multiple Word Program Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Setup Phase.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Program Phase. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Verify Phase. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Exit Phase. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 3. Standard Commands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 4. Multiple Word Program Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 5. Program Times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 7. Multiple Word Program Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2/26 M27W016 STATUS REGISTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Data Polling Bit (DQ7). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Toggle Bit (DQ6).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Error Bit (DQ5). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 VPP Status Bit (DQ4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Multiple Word Program Bit (DQ0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Multiple Word Program Bit (DQ0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Table 6. Status Register Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 8. Data Polling Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 9. Data Toggle Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Table 7. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 DC and AC PARAMETERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Table 8. Operating and AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 10. AC Measurement I/O Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 11. AC Measurement Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Table 9. Device Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Table 10. DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Figure 12. Read AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Table 11. Read AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 13. Chip Enable Controlled, Write AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Table 12. Chip Enable Controlled, Write AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 SO44 - 44 lead Plastic Small Outline, 500 mils body width, Package Outline . . . . . . . . . . . . . . . . 20 SO44 - 44 lead Plastic Small Outline, 500 mils body width, Package Mechanical Data . . . . . . . . . 20 TSOP48 - 48 lead Plastic Thin Small Outline, 12 x 20mm, Package Outline . . . . . . . . . . . . . . . . . 21 TSOP48 - 48 lead Plastic Thin Small Outline, 12 x 20mm, Package Mechanical Data . . . . . . . . . 21 PDIP42 - 42 pin Plastic DIP, 600 mils width, Bottom View Package Outline . . . . . . . . . . . . . . . . . 22 PDIP42 - 42 pin Plastic DIP, 600 mils width, Package Mechanical Data . . . . . . . . . . . . . . . . . . . . 22 SDIP42 - 42 pin Shrink Plastic DIP, 600 mils width, Package Outline . . . . . . . . . . . . . . . . . . . . . . 23 SDIP42 - 42 pin Shrink Plastic DIP, 600 mils width, Package Mechanical Data . . . . . . . . . . . . . . . 23 PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Table 17. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 REVISION HISTORY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Table 18. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 3/26 M27W016 SUMMARY DESCRIPTION The M27W016 is a 16 Mbit (2Mb x16) non-volatile, One Time Programmable (OTP), FlexibleROMTM Memory. Read operations can be performed using a single low voltage (2.7 to 3.6V) supply. Program operations require an additional VPP (11.4 to 12.6V) power supply. On power-up the memory defaults to Read mode where it can be read in the same way as a ROM or EPROM. Program commands are written to the Command Interface of the memory. An on-chip Program Controller (PC) simplifies the process of programming the memory by taking care of all of the special operations that are required to update the memory contents. The M27W016 features an innovative command, Multiple Word Program, used to program large streams of data. It greatly reduces the total pro- gramming time when a large number of Words are written to the memory at any one time. Using this command the entire memory can be programmed in 2s, compared to 9s using the standard Word Program. The end of a program operation can be detected and any error conditions identified. The command set required to control the memory is consistent with JEDEC standards. Chip Enable and Output Enable signals control the bus operation of the memory. They allow simple connection to most microprocessors, often without additional logic. The memory is offered in SO44, TSOP48 (12 x 20mm), PDIP42 and SDIP42 packages. The memory is supplied with all the bits set to '1'. Figure 2. Logic Diagram Table 1. Signal Names A0-A19 DQ0-DQ15 Address Inputs Data Inputs/Outputs Chip Enable Output Enable Supply Voltage read Supply Voltage program Ground Not Connected Internally VCC VPP E G 20 A0-A19 16 DQ0-DQ15 VCC VPP E G M27W016 VSS NC VSS AI05906 4/26 M27W016 Figure 3. PDIP Connections A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 E VSS G DQ0 DQ8 DQ1 DQ9 DQ2 DQ10 DQ3 DQ11 1 42 2 41 3 40 4 39 5 38 6 37 7 36 35 8 9 34 10 33 M27W016 32 11 31 12 30 13 29 14 28 15 27 16 17 26 18 25 19 24 20 23 22 21 AI05907 Figure 4. SDIP Connections A19 A8 A9 A10 A11 A12 A13 A14 A15 A16 VPP VSS DQ15 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 VCC A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 E VSS G DQ0 DQ8 DQ1 DQ9 DQ2 DQ10 DQ3 DQ11 1 42 2 41 3 40 4 39 5 38 6 37 7 36 35 8 9 34 10 33 M27W016 32 11 31 12 30 13 29 14 28 15 27 16 17 26 18 25 19 24 20 23 22 21 AI05907 A19 A8 A9 A10 A11 A12 A13 A14 A15 A16 VPP VSS DQ15 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 VCC 5/26 M27W016 Figure 5. SO Connections Figure 6. TSOP Connections VPP NC A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 E VSS G DQ0 DQ8 DQ1 DQ9 DQ2 DQ10 DQ3 DQ11 1 44 43 2 3 42 4 41 40 5 39 6 38 7 37 8 36 9 35 10 11 M27W016 34 33 12 32 13 31 14 30 15 29 16 17 28 18 27 19 26 20 25 21 24 22 23 NC A19 A8 A9 A10 A11 A12 A13 A14 A15 A16 VPP VSS DQ15 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 VCC AI05909 1 48 A16 A15 A14 A13 A12 A11 A10 A9 A8 A19 VSS NC A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 E 24 25 VSS VSS DQ15 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 VCC VCC NC DQ11 DQ3 DQ10 DQ2 DQ9 DQ1 DQ8 DQ0 G VSS VSS AI05917 12 13 M27W016 37 36 6/26 M27W016 SIGNAL DESCRIPTIONS See Figure 2, Logic Diagram, and Table 1, Signal Names, for a brief overview of the signals connected to this device. Address Inputs (A0-A19). The Address Inputs select the cells in the memory array to access during Bus Read operations. During Bus Write operations they control the commands sent to the Command Interface of the Program Controller. Data Inputs/Outputs (DQ0-DQ7). The Data Inputs/Outputs output the data stored at the selected address during a Bus Read operation. During Bus Write operations they represent the command sent to the Command Interface of the Program Controller. When reading the Status Register they report the status of the ongoing algorithm. Data Inputs/Outputs (DQ8-DQ15). The Data Inputs/Outputs output the data stored at the selected address during a Bus Read operation. During Bus Write operations the Command Interface does not use these bits. When reading the Status Register these bits should be ignored. Chip Enable (E). The Chip Enable, E, activates the memory, allowing Bus Read operations to be performed. It also controls the Bus Write operations, when VPP is in the VHH range. Output Enable (G). The Output Enable, G, controls the Bus Read operations of the memory. It also allows Bus Write operations, when VPP is in the VHH range. VCC Supply Voltage. The VCC Supply Voltage supplies the power for Read operations. A 0.1F capacitor should be connected between the VCC Supply Voltage pin and the VSS Ground pin to decouple the current surges from the power supply. The PCB track widths must be sufficient to carry the currents required during program operations, ICC3. V PP Program Supply Voltage. VPP is both a power supply and Write Protect pin. The two functions are selected by the voltage range applied to the pin. When the VPP is in the VHH range (see Table 10, DC Characteristic, for the relevant values) the Program operation is enabled. During such operations the VPP must be stable in the VHH range. If the VPP is kept under the VHH range, particularly in the voltage range 0 to 3.6V, any Program operation is disabled or stopped. Note that VPP must not be left floating or unconnected as the device may become unreliable. Vss Ground. The VSS Ground is the reference for all voltage measurements. 7/26 M27W016 BUS OPERATIONS There are six standard bus operations that control the device. These are Bus Read, Bus Write, Output Disable, Standby, Automatic Standby and Electronic Signature. See Tables 2, Bus Operations, for a summary. Typically glitches of less than 5ns on Chip Enable or Write Enable are ignored by the memory and do not affect bus operations. Bus Read. Bus Read operations read from the memory cells, or specific registers in the Command Interface. A valid Bus Read operation involves setting the desired address on the Address Inputs and applying a Low signal, VIL, to Chip Enable and Output Enable. The Data Inputs/Outputs will output the value, see Figure 12, Read AC Waveforms, and Table 11, Read AC Characteristics, for details of when the output becomes valid. Bus Write. Bus Write operations write to the Command Interface. Bus Write is enabled only when VPP is set to VHH. A valid Bus Write operation begins by setting the desired address on the Address Inputs. The Address Inputs are latched by the Command Interface on the falling edge of Chip Enable. The Data Inputs/Outputs are latched by the Command Interface on the rising edge of Chip Enable. Output Enable must remain High, VIH, during the whole Bus Write operation. See Figure 13, Write AC Waveforms, and Table 12, Write AC Characteristics, for details of the timing requirements. Table 2. Bus Operations Operation Bus Read Bus Write Output Disable Standby Read Manufacturer Code Read Device Code E VIL VIL X VIH VIL VIL G VIL VIH VIH X VIL VIL VPP XX(3) VHH X X VHH VHH Address Inputs A0-A19 Cell Address Command Address X X A0 = VIL, A1 = VIL, Others VIL or VIH A0 = VIH, A1 = VIL, Others VIL or VIH Data Inputs/Outputs DQ15-DQ0 Data Output Data Input Hi-Z Hi-Z 0020h 888Dh Output Disable. The Data Inputs/Outputs are in the high impedance state when Output Enable is High, VIH. Standby. When Chip Enable is High, VIH, the memory enters Standby mode and the Data Inputs/Outputs pins are placed in the high-impedance state. To reduce the Supply Current to the Standby Supply Current, ICC2, Chip Enable should be held within VCC 0.2V. For the Standby current level see Table 10, DC Characteristics. During program operation the memory will continue to use the Program Supply Current, ICC3, for Program operation until the operation completes. Automatic Standby. If CMOS levels (VCC 0.2V) are used to drive the bus and the bus is inactive for 150ns or more the memory enters Automatic Standby where the internal Supply Current is reduced to the Standby Supply Current, ICC2. The Data Inputs/Outputs will still output data if a Bus Read operation is in progress. Electronic Signature. The memory has two codes, the manufacturer code and the device code, that can be read to identify the memory. These codes can be read by applying the signals listed in Tables 2, Bus Operations, once the Auto Select Command is executed. To exit Electronic Signature mode, the Read/Reset command must be issued. Note: 1. X = VIL or VIH. 2. XX = VIL, VIH or VHH 3. When reading Status Register during Program algorithm execution VPP must be kept at VHH. 8/26 M27W016 COMMAND INTERFACE All Bus Write operations to the memory are interpreted by the Command Interface. Commands consist of one or more sequential Bus Write operations. Failure to observe a valid sequence of Bus Write operations will result in the memory returning to Read mode. The long command sequences are imposed to maximize data security. Refer to Tables 3 and 4, for a summary of the commands. Read/Reset Command. The Read/Reset command returns the memory to its Read mode where it behaves like a ROM or EPROM, unless otherwise stated. It also resets the errors in the Status Register. Either one or three Bus Write operations can be used to issue the Read/Reset command. VPP must be set to VHH during the Read/Reset command. If VPP is set to either VIL or VIH the command will be ignored. The command can be issued, between Bus Write cycles before the start of a program operation, to return the device to read mode. Once the program operation has started the Read/Reset command is no longer accepted. Auto Select Command. The Auto Select command is used to read the Manufacturer Code and the Device Code. VPP must be set to VHH during the Auto Select command. If VPP is set to either VIL or VIH the command will be ignored. Three consecutive Bus Write operations are required to issue the Auto Select command. Once the Auto Select command is issued the memory remains in Auto Select mode until a Read/Reset command is issued, all other commands are ignored. From the Auto Select mode the Manufacturer Code can be read using a Bus Read operation with A0 = VIL and A1 = VIL. The other address bits may be set to either VIL or VIH. The Device Code can be read using a Bus Read operation with A0 = VIH and A1 = VIL. The other address bits may be set to either VIL or VIH. Word Program Command. The Word Program command can be used to program a Word to the memory array. VPP must be set to VHH during Word Program. If VPP is set to either VIL or VIH the command will be ignored, the data will remain unchanged and the device will revert to Read/Reset mode. The command requires four Bus Write operations, the final write operation latches the address and data in the internal state machine and starts the PC. During the program operation the memory will ignore all commands. It is not possible to issue any command to abort or pause the operation. Typical program times are given in Table 5. Bus Read op- erations during the program operation will output the Status Register on the Data Inputs/Outputs. See the section on the Status Register for more details. After the program operation has completed the memory will return to the Read mode, unless an error has occurred. When an error occurs the memory will continue to output the Status Register. A Read/Reset command must be issued to reset the error condition and return to Read mode. Note that the Program command cannot change a bit set at '0' back to '1'. Multiple Word Program Command The Multiple Word Program command can be used to program large streams of data. It greatly reduces the total programming time when a large number of Words are written in the memory at once. VPP must be set to VHH during Multiple Word Program. If VPP is set either VIL or VIH the command will be ignored, the data will remain unchanged and the device will revert to Read mode. It has four phases: the Setup Phase to initiate the command, the Program Phase to program the data to the memory, the Verify Phase to check that the data has been correctly programmed and reprogram if necessary and the Exit Phase. Setup Phase. The Multiple Word Program command requires three Bus Write operations to initiate the command (refer to Table 4, Multiple Word Program Command and Figure 8, Multiple Word Program Flowchart). The Status Register must be read in order to check that the PC has started (see Table 6 and Figure 8). Program Phase. The Program Phase requires n+1 Bus Write operations, where n is the number of Words, to execute the programming phase (refer to Table 4, Multiple Word Program and Figure 7, Multiple Word Program Flowchart). Before any Bus Write operation of the Program Phase, the Status Register must be read in order to check that the PC is ready to accept the operation (see Table 6 and Figure 8). The Program Phase is executed in three different sub-phases: 1. The first Bus Write operation of the Program Phase (the 4th of the command) latches the Start Address and the first Word to be programmed. 2. Each subsequent Bus Write operation latches the next Word to be programmed and automatically increments the internal Address Bus. It is not necessary to provide the address of the location to be programmed but only a Continue Address, CA (A17 to A19 equal to the 9/26 M27W016 Start Address), that indicates to the PC that the Program Phase has to continue. A0 to A16 are `don't care'. 3. Finally, after all Words have been programmed, a Bus Write operation (the (n+1)th) with a Final Address, FA (A17 or a higher address pin different from the Start Address), ends the Program Phase. The memory is now set to enter the Verify Phase. Verify Phase. The Verify Phase is similar to the Program Phase in that all Words must be resent to the memory for them to be checked against the programmed data. Before any Bus Write Operation of the Verify Phase, the Status Register must be read in order to check that the PC is ready for the next operation or if the reprogram of the location has failed (see Table 6 and Figure 8). Three successive steps are required to execute the Verify Phase of the command: 1. The first Bus Write operation of the Verify Phase latches the Start Address and the Word to be verified. 2. Each subsequent Bus Write operation latches the next Word to be verified and automatically increments the internal Address Bus. As in the Program Phase, it is not necessary to provide the address of the location to be programmed but only a Continue Address, CA (A17 to A19 equal to the Start Address). 3. Finally, after all Words have been verified, a Bus Write cycle with a Final Address, FA (A17 or a higher address pin different from the Start Address) ends the Verify Phase. Exit Phase. After the Verify Phase ends, the Status Register must be read to check if the command has successfully completed or not (see Table 6 and Figure 8). If the Verify Phase is successful, the memory returns to Read mode and DQ6 stops toggling. If the PC fails to reprogram a given location, the Verify Phase terminates, DQ6 continues toggling and error bit DQ5 is set in the Status Register. If the error is due to a VPP failure DQ4 is also set. When the operation fails a Read/Reset command must be issued to return the device to Read mode. During the Multiple Word Program operation the memory will ignore all commands. It is not possible to issue any command to abort or pause the operation. Typical program times are given in Table 5. Bus Read operations during the program operation will output the Status Register on the Data Inputs/Outputs. See the section on the Status Register for more details. Note that the Multiple Word Program command cannot change a bit set to '0' back to '1'. 10/26 M27W016 Table 3. Standard Commands Length Bus Write Operations 1st Add X 555 555 555 Data F0 AA AA AA 2AA 2AA 2AA 55 55 55 X 555 555 F0 90 A0 PA PD Add 2nd Data Add 3rd Data Add 4th Data Command 1 Read/Reset 3 Auto Select Word Program 3 4 Note: X Don't Care, PA Program Address, PD Program Data. All values in the table are in hexadecimal. The Command Interface only uses A0-A10 and DQ0-DQ7 to verify the commands; A11-A19, DQ8-DQ15 are Don't Care. Table 4. Multiple Word Program Command Phase Length Bus Write Operations 1st Add 555 SA SA Data AA PD1 PD1 2nd Add 2AA CA CA Data 55 PD2 PD2 3rd Add 555 CA CA Data 20 PD3 PD3 CA CA PD4 PD4 CA CA PD5 PD5 CA CA PAn PAn FA FA X X 4th Add Data 5th Add Data nth Add Data Final Add Data Set-Up Program Verify 3 n+1 n+1 Note: A Bus Read must be done between each Write cycle where the data is programmed or verified, to Read the Status Register and check that the memory is ready to accept the next data. SA is the Start Address. CA is the Continue Address. FA is the Final Address. X Don't Care, n = number of Words to be programmed. Table 5. Program Times Parameter Program (Word) Chip Program (Multiple Word) Chip Program (Word by Word) Note: 1. TA = 25C, VPP = 12V. Typ (1) 9 2 9 Max 200 35 35 Unit s s s 11/26 M27W016 Figure 7. Multiple Word Program Flowchart Setup Phase Start Write AAh Address 555h Read Status Register Verify Phase Write 55h Address 2AAh DQ0 = 0? NO Write 20h Address 555h Write Data1 Start Address Read Status Register NO Setup time exceeded? YES EXIT (setup failed) NO DQ0 = 0? YES Program Phase Write Data1 Start Address NO DQ6 toggling? YES Read Status Register NO DQ0 = 0? YES Write Data 2 Continue Address NO DQ5 = 1 ? YES Read Status Register NO Read Status Register DQ0 = 0? YES NO DQ5 = 1? YES DQ0 = 0? YES Write Data 2 Continue Address NO Write Data n Continue Address Read Status Register NO Read Status Register NO DQ0 = 0? YES DQ5 = 1? YES Exit Phase DQ0 = 0? YES Write Data n Continue Address NO Write XX Final Address Read Status Register YES Read Status Register DQ4 = 0? NO Read Status Register DQ6 toggling? DQ0 = 0? YES Write XX Final Address NO NO YES Fail error Fail, VPP error Write F0h Address XX Exit (read mode) AI05954b 12/26 M27W016 STATUS REGISTER Bus Read operations from any address always read the Status Register during Program operations. The bits in the Status Register are summarized in Table 6, Status Register Bits. Data Polling Bit (DQ7). The Data Polling Bit can be used to identify whether the Program Controller has successfully completed its operation. The Data Polling Bit is output on DQ7 when the Status Register is read. During a Word Program operation the Data Polling Bit outputs the complement of the bit being programmed to DQ7. After successful completion of the Word Program operation the memory returns to Read mode and Bus Read operations from the address just programmed output DQ7, not its complement. Figure 8, Data Polling Flowchart, gives an example of how to use the Data Polling Bit. A Valid Address is the address being programmed. Toggle Bit (DQ6). The Toggle Bit can be used to identify whether the Program Controller has successfully completed its operation. The Toggle Bit is output on DQ6 when the Status Register is read. During Program operations the Toggle Bit changes from '0' to '1' to '0', etc., with successive Bus Read operations at any address. After successful completion of the operation the memory returns to Read mode. Figure 9, Data Toggle Flowchart, gives an example of how to use the Data Toggle Bit. Error Bit (DQ5). The Error Bit can be used to identify errors detected by the Program Controller. The Error Bit is set to '1' when a Program operation fails to write the correct data to the memory. If the Error Bit is set a Read/Reset command must be issued before other commands are issued. The Error bit is output on DQ5 when the Status Register is read. Note that the Program command cannot change a bit set to '0' back to '1' and attempting to do so will set DQ5 to `1'. A Bus Read operation to that address will show the bit is still `0'. VPP Status Bit (DQ4). The VPP Status Bit can be used to identify if any Program operation has failed due to a VPP error. If VPP falls below VHH during any Program operation, the operation aborts and DQ4 is set to `1'. If VPP remains at VHH throughout the Program operation, the operation completes and DQ4 is set to `0'. Multiple Word Program Bit (DQ0). The Multiple Word Program Bit can be used to indicate whether the Program Controller is active or inactive during Multiple Word Program. When the Program Controller has written one Word and is ready to accept the next Word, the bit is set to `0'. Status Register Bit DQ1 is reserved. 13/26 M27W016 Table 6. Status Register Bits Command (1) P.C. Status Programming Multiple Word Program Waiting for data Program fail Programming Word Program Program error DQ7 Toggle 1 (2) DQ7 - - - DQ7 DQ6 Toggle Toggle Toggle Toggle DQ5 0 0 1 0 DQ4 - - (2) DQ3 0 0 0 0 0 DQ0 1 0 1 - - - Note: 1. Unspecified data bits should be ignored. 2. DQ4 = 0 if VPP VHH during Program algorithm execution; DQ4 = 1 if VPP < VHH during Program algorithm execution. Figure 8. Data Polling Flowchart Figure 9. Data Toggle Flowchart START READ DQ5 & DQ6 START READ DQ5 & DQ7 at VALID ADDRESS READ DQ6 DQ7 = DATA NO NO YES DQ6 = TOGGLE YES NO DQ5 =1 NO YES READ DQ7 at VALID ADDRESS DQ5 =1 YES READ DQ6 TWICE DQ7 = DATA NO FAIL YES DQ6 = TOGGLE PASS NO YES FAIL PASS AI01370B AI03598 14/26 M27W016 MAXIMUM RATING Stressing the device above the rating listed in the Absolute Maximum Ratings" table may cause permanent damage to the device. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. These are stress ratings only and operation of the device at Table 7. Absolute Maximum Ratings Symbol TBIAS TSTG VIO VCC VPP Temperature Under Bias Storage Temperature Input or Output Voltage (1,2) Read Supply Voltage Program Supply Voltage (3) Parameter Min -50 -65 -0.6 -0.6 -0.6 Max 125 150 VCC +0.6 4 13.5 Unit C C V V V these or any other conditions above those indicated in the Operating sections of this specification is not implied. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Note: 1. Minimum voltage may undershoot to -2V for less than 20ns during transitions. 2. Maximum voltage may overshoot to V CC +2V for less than 20ns during transitions. 3. Maximum voltage may overshoot to 14.0V for less than 20ns during transitions. VPP must not remain at VHH for more than a total of 80hrs. 15/26 M27W016 DC AND AC PARAMETERS This section summarizes the operating measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC and AC characteristics Tables that follow, are derived from tests performed under the Measurement Conditions summarized in Table 8, Operating and AC Measurement Conditions. Designers should check that the operating conditions in their circuit match the operating conditions when relying on the quoted parameters. Table 8. Operating and AC Measurement Conditions M27W016 Parameter Min VCC Read Supply Voltage VPP Program Supply Voltage Ambient Operating Temperature Load Capacitance (CL) Input Rise and Fall Times Input Pulse Voltages Input and Output Timing Ref. Voltages 0 to 3 1.5 2.7 11.4 0 30 10 100, 110 Max 3.6 12.6 70 V V C pF ns V V Unit Figure 10. AC Measurement I/O Waveform Figure 11. AC Measurement Load Circuit 1.3V 1N914 3V 1.5V 0V AI05546 3.3k DEVICE UNDER TEST CL OUT CL = 30pF CL includes JIG capacitance AI05447 Table 9. Device Capacitance Symbol CIN COUT Parameter Input Capacitance Output Capacitance Test Condition VIN = 0V VOUT = 0V Min Max 6 12 Unit pF pF Note: Sampled only, not 100% tested. 16/26 M27W016 Table 10. DC Characteristics Symbol ILI ILO ICC1 ICC2 (2) ICC3 VIL VIH VOL VOH VHH IHH Parameter (1) Input Leakage Current Output Leakage Current Supply Current (Read) Supply Current (Standby) Supply Current (Program) Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage VPP Program Voltage VPP Current (Program) PC Active IOL = 1.8mA IOH = -100A VCC -0.4 11.4 12.6 10 Test Condition 0V VIN VCC 0V VOUT VCC E = VIL, G = VIH, IOUT = 0mA, f = 6MHz E = VCC 0.2V PC active -0.5 0.7VCC Min Max 1 1 10 100 20 0.8 VCC +0.3 0.45 Unit A A mA A mA V V V V V mA Note: 1. VCC must be applied simultaneously or before VPP and removed simultaneously or after VPP. 2. Average Value. 17/26 M27W016 Figure 12. Read AC Waveforms A0-A19 tAVQV E tELQV G tGLQV DQ0-DQ15 VALID tAXQX tEHQZ tGHQZ VALID AI05812 Table 11. Read AC Characteristics M27W016 Symbol Alt Parameter (1) Test Condition E = VIL, G = VIL G = VIL E = VIL G = VIL E = VIL 100 110 Unit VCC = 3.0 to 3.6V VCC = 2.7 to 3.6V VCC = 2.7 to 3.6V tAVQV tELQV tGLQV tEHQZ (2) tGHQZ (2) tAXQX tACC tCE tOE tHZ tDF tOH Address Valid to Output Valid Chip Enable Low to Output Valid Output Enable Low to Output Valid Chip Enable High to Output Hi-Z Output Enable High to Output Hi-Z Address Transition to Output Transition Max Max Max Max Max Min 80 80 35 30 30 0 100 100 35 30 30 0 110 110 35 30 30 0 ns ns ns ns ns ns Note: 1. VPP must be applied after VCC and with the Chip Enable (E) at VIH. 2. Sampled only, not 100% tested. 18/26 M27W016 Figure 13. Chip Enable Controlled, Write AC Waveforms A0-A19 VALID tELAX tAVEL tEHGL G tGHEL E tEHEL tDVEH DQ0-DQ15 VALID tEHDX tELEH VCC tVCHEL VPP tVPHEL AI05583 Table 12. Chip Enable Controlled, Write AC Characteristics Symbol tELEH tDVEH tEHDX tEHEL tAVEL tELAX tGHEL tEHGL tVCHEL tVPHEL(2) tOEH tVCS tVCS Alt tCP tDS tDH tCPH tAS tAH Parameter (1) Chip Enable Low to Chip Enable High Input Valid to Chip Enable High Chip Enable High to Input Transition Chip Enable High to Chip Enable Low Address Valid to Chip Enable Low Chip Enable Low to Address Transition Output Enable High Chip Enable Low Chip Enable High to Output Enable Low VCC High to Chip Enable Low VPP High to Chip Enable Low Min Min Min Min Min Min Min Min Min Min M27W016 50 50 0 50 0 100 10 10 50 500 Unit ns ns ns ns ns ns ns ns s ns Note: 1. TA = 25C; VPP = 11.4 to 12.6V. VCC = 2.7 to 3.6V. VPP must be applied after VCC and with the Chip Enable (E) at VIH. Sampled only, not 100% tested. 2. Not required in Auto Select or Read/Reset command sequences. 19/26 M27W016 PACKAGE MECHANICAL Figure 14. SO44 - 44 lead Plastic Small Outline, 500 mils body width, Package Outline D 44 23 c E1 E 1 22 A1 A2 b SO-F Note: Drawing is not to scale. L L1 A ddd e Table 13. SO44 - 44 lead Plastic Small Outline, 500 mils body width, Package Mechanical Data millimeters Symbol Typ A A1 A2 b c D ddd E E1 e L L1 N 44 16.03 12.60 1.27 0.79 1.73 8 44 15.77 12.47 - 28.50 0.10 2.69 2.56 0.35 0.18 28.37 2.79 0.50 0.28 28.63 0.10 16.28 12.73 - 0.631 0.496 0.050 0.031 0.068 8 0.621 0.491 - 1.122 Min Max 3.00 0.004 0.106 0.101 0.014 0.007 1.117 0.110 0.020 0.011 1.127 0.004 0.641 0.501 - Typ Min Max 0.118 inches 20/26 M27W016 Figure 15. TSOP48 - 48 lead Plastic Thin Small Outline, 12 x 20mm, Package Outline 1 48 e D1 B 24 25 L1 A2 A E1 E DIE A1 C CP L TSOP-G Note: Drawing is not to scale. Table 14. TSOP48 - 48 lead Plastic Thin Small Outline, 12 x 20mm, Package Mechanical Data millimeters Symbol Typ A A1 A2 B C CP D1 E E1 e L L1 12.000 20.000 18.400 0.500 0.600 0.800 3 0 5 11.900 19.800 18.300 - 0.500 0.100 1.000 0.220 0.050 0.950 0.170 0.100 Min Max 1.200 0.150 1.050 0.270 0.210 0.080 12.100 20.200 18.500 - 0.700 0.4724 0.7874 0.7244 0.0197 0.0236 0.0315 3 0 5 0.4685 0.7795 0.7205 - 0.0197 0.0039 0.0394 0.0087 0.0020 0.0374 0.0067 0.0039 Typ Min Max 0.0472 0.0059 0.0413 0.0106 0.0083 0.0031 0.4764 0.7953 0.7283 - 0.0276 inches 21/26 M27W016 Figure 16. PDIP42 - 42 pin Plastic DIP, 600 mils width, Bottom View Package Outline A2 A1 B1 B D2 D S N A L eA eB C e1 E1 1 E PDIP Note: Drawing is not to scale. Table 15. PDIP42 - 42 pin Plastic DIP, 600 mils width, Package Mechanical Data millimeters Symbol Typ A A1 A2 B B1 C D D2 E E1 e1 eA eB L S N 2.54 14.99 50.80 15.24 Min - 0.25 3.56 0.38 1.27 0.20 52.20 - - 13.59 - - 15.24 3.18 0.86 0 42 Max 5.08 - 4.06 0.53 1.65 0.36 52.71 - - 13.84 - - 17.78 3.43 1.37 10 0.100 0.590 2.000 0.600 Typ Min - 0.010 0.140 0.015 0.050 0.008 2.055 - - 0.535 - - 0.600 0.125 0.034 0 42 Max 0.200 - 0.160 0.021 0.065 0.014 2.075 - - 0.545 - - 0.700 0.135 0.054 10 inches 22/26 M27W016 Figure 17. SDIP42 - 42 pin Shrink Plastic DIP, 600 mils width, Package Outline A2 A1 b2 b D2 D S N A L eA eB c e E1 1 E SDIP Note: Drawing is not to scale. Table 16. SDIP42 - 42 pin Shrink Plastic DIP, 600 mils width, Package Mechanical Data millimeters Symbol Typ A A1 A2 b b2 c D e E E1 eA eB L S N 3.30 0.64 42 2.54 13.72 15.24 3.81 0.46 1.02 0.25 36.83 1.78 0.51 3.05 0.38 0.89 0.23 36.58 - 15.24 12.70 - 4.57 0.56 1.14 0.38 37.08 - 16.00 14.48 - 18.54 3.56 0.130 0.025 42 0.100 0.540 0.600 0.150 0.018 0.040 0.010 1.450 0.070 Min Max 5.08 0.020 0.120 0.015 0.035 0.009 1.440 - 0.600 0.500 - 0.180 0.022 0.045 0.015 1.460 - 0.630 0.570 - 0.730 0.140 Typ Min Max 0.200 inches 23/26 M27W016 PART NUMBERING Table 17. Ordering Information Scheme Example: Device Type M27 = FlexibleROMTM Memory Operating Voltage W = VCC = 2.7 to 3.6V Device Function 016 = 16 Mbit (x16) Speed 100 = 100 ns (1) 110 = 110 ns Package M = SO44, 500mils body width N = TSOP48: 12 x 20 mm B = PDIP42 S = SDIP42 Temperature Range 1 = 0 to 70 C Option T = Tape & Reel Packing M27W016 100 N 1 T Note: 1. This speed also guarantees 80ns access time at VCC = 3.0 to 3.6V. Devices are shipped from the factory with all the bits set to '1'. For a list of available options (Speed, Package, etc...) or for further information on any aspect of this device, please contact the ST Sales Office nearest to you. 24/26 M27W016 REVISION HISTORY Table 18. Document Revision History Date 28-Jan-2002 Version 1.0 First Issue Output Enable paragraph clarified Electronic Signature paragraph clarified Multiple Word Command paragraph clarified (Paragraph rewritten, Table 4, Figure 7) Status Register Bits table clarified (Table 6) SO44 package mechanical data and drawing clarified (Figure 14, Table 13) PLCC44 package removed Document status changed to Product Preview Device classification changed to Fast OTP Program Phase and Verify Phase paragraphs clarified Standard Commands table clarified (Table 3) Multiple Word Program Command table and Flowchart clarified (Table 4, Figure 7) AC Measurement Load Circuit clarified (Figure 11) Read AC parameters clarified (Figure 12, Table 11) Chip Enable Controlled, Write AC parameters clarified (Figure 13, Table 12) Document status changed to Preliminary Data Document title clarified 100ns speed class added (90ns at VCC = 3.0 to 3.6V) Product Name changed Multiple Word Program Command Table clarified (Table 4) ICC1, ICC2 clarified (Table 10) Product Naming revised Document status changed to Datasheet OTP specification added SO44 package changed to 500mils body width Bus Operation table clarified (Table 2) Read/Reset , Auto Select and Multiple Word Program commands clarified 90ns speed class obtained from the 100ns at VCC = 3.0 to 3.6V - clarifiication (Table 11 and 12) TSOP Connections diagram updated (Figure 6) Typing error on page 1 corrected TSOP48 Package Mechanical and Data updated (Figure 15, Table 14) 100ns speed class also guarantees 80ns Revision Details 15-May-2002 2.0 17-Jun-2002 3.0 28-Jun-2002 09-Jul-2002 31-Jul-2002 27-Sep-2002 4.0 5.0 5.1 5.2 14-Nov-2002 5.3 29-Nov-2002 20-Feb-2003 05-Mar-2003 17-Nov-2003 5.4 5.5 5.6 5.7 25/26 M27W016 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics FlexibleROM is a pending trademark of STMicroelectronics All other names are the property of their respective owners (c) 2003 STMicroelectronics - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States www.st.com 26/26 |
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